Materials science

Materials for High-Density Electronic Packaging and Interconnection

by Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Research Council

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http://www.nap.edu/1624

National Academies Press

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Bibliographic Information

Publisher National Academies Press
Publication Date February 1990
Orginal LanguageEnglish
ISBN/Identifier 9780309042338 / 030904233X
Publication Country or regionUnited States
FormatPaperback
Primary Price 19 USD
Pages156
ReadershipProfessional and scholarly
Publish StatusPublished
Dimensions11 x 8.5 inches

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Materials for High-Density Electronic Packaging and Interconnection

by Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Research Council

More Information

Rights Information

Marketing Information

National Academies Press

Bibliographic Information

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Materials for High-Density Electronic Packaging and Interconnection

by Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Research Council

More Information

Rights Information

Marketing Information

National Academies Press

Bibliographic Information

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